News

Reworking chip grants; global semi, equipment sales up; GF's $16B expansion; Arm's AI-defined vehicles platform; Mexico's ...
A new technical paper titled “Ramping Up Open-Source RISC-V Cores: Assessing the Energy Efficiency of Superscalar, ...
A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at ...
Smart glasses with augmented reality functions look more natural than VR goggles, but today they are heavily reliant on a ...
Tailoring security subsystems to unique application requirements.
Broad Range of Potential Attacks: If an attacker is able to gain access to data on an Ethernet connection, a range of attacks ...
Multi-die assemblies enable more analog content, but that adds new security vulnerabilities for which there is little ...
Siemens has unveiled its Questa One functional safety solution, setting a new standard in the verification and validation of ...
Today, we are witnessing a paradigm shift towards a more modular design approach that disaggregates SoC functions into ...
Edge AI, GenAI, and next-gen communications are adding more workloads to phones that are already under pressure to deliver ...
Centric Analysis of DeepSeek’s Multi-Head Latent Attention” was published by researchers at KU Leuven. Abstract “Multi-Head Latent Attention (MLA), introduced in DeepSeek-V2, improves the efficiency ...
Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics” was published by ...